Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging

Subjects

Subjects :

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials

Details

ISSN :

00262714

Volume :

130

Database :

OpenAIRE

Journal :

Microelectronics Reliability

Accession number :

edsair.doi...........65607468df0ccf9d464ca1047836374a

Full Text :

https://doi.org/10.1016/j.microrel.2022.114488