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Alignment-free injection-molded plastic modules for free-space optical interconnection

Authors :
D.T. Neilson
E. Schenfeld
Tae J. Kim
Source :
Technical Digest. Summaries of Papers Presented at the Conference on Lasers and Electro-Optics. Conference Edition. 1998 Technical Digest Series, Vol.6 (IEEE Cat. No.98CH36178).
Publication Year :
1998
Publisher :
IEEE, 1998.

Abstract

We propose a solution to this packaging and alignment problem by using low-cost, injection-molded plastic optical multichip modules (OMCM). This OMCM is a complete hybrid integration of optical, optomechanical, optoelectronic, and electronic components in a self-aligned single platform. The module integrates microlenses, beam-splitting surfaces, and module-to-module connectors and spacers and has room for integrating the optoelectronics devices directly on it.

Details

Database :
OpenAIRE
Journal :
Technical Digest. Summaries of Papers Presented at the Conference on Lasers and Electro-Optics. Conference Edition. 1998 Technical Digest Series, Vol.6 (IEEE Cat. No.98CH36178)
Accession number :
edsair.doi...........64b0c0f602972bf035f5a1004e60559a
Full Text :
https://doi.org/10.1109/cleo.1998.676284