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Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan

Authors :
Jingru Sun
Jinglong Li
Hongrui Zhang
Jiangtao Xiong
J.C. Wang
Junmiao Shi
Source :
Journal of Manufacturing Processes. 47:238-243
Publication Year :
2019
Publisher :
Elsevier BV, 2019.

Abstract

The immersion ultrasonic C-scan ((IUCT) test was conducted for evaluating the bonded ratio of the TC4 diffusion bonded joints. The signal characteristics reflected by the typical bonding states of the joint, gap, kissing bond, microvoids and sound bond were investigated in the time and frequency domain. Moreover, as for the bonding state of microvoids, its local bonded ratio exhibited a linear relationship with the relative amplitude of its echo signal in the time domain. Based on the echo signal characteristics and the linear relationship about microvoids, a MATLAB algorithm program was developed to calculate the global bonded ratio of bonding interface directly from echo signal of IUCT. The results demonstrated that joint bonded ratio and mechanical properties, especially the tensile strength, could be quantitively evaluated by the combination of IUCT test and the developed MATLAB program.

Details

ISSN :
15266125
Volume :
47
Database :
OpenAIRE
Journal :
Journal of Manufacturing Processes
Accession number :
edsair.doi...........64a8fa7dbef2f4ff7cd4c5fa5dc7fa4d
Full Text :
https://doi.org/10.1016/j.jmapro.2019.09.025