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Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan
- Source :
- Journal of Manufacturing Processes. 47:238-243
- Publication Year :
- 2019
- Publisher :
- Elsevier BV, 2019.
-
Abstract
- The immersion ultrasonic C-scan ((IUCT) test was conducted for evaluating the bonded ratio of the TC4 diffusion bonded joints. The signal characteristics reflected by the typical bonding states of the joint, gap, kissing bond, microvoids and sound bond were investigated in the time and frequency domain. Moreover, as for the bonding state of microvoids, its local bonded ratio exhibited a linear relationship with the relative amplitude of its echo signal in the time domain. Based on the echo signal characteristics and the linear relationship about microvoids, a MATLAB algorithm program was developed to calculate the global bonded ratio of bonding interface directly from echo signal of IUCT. The results demonstrated that joint bonded ratio and mechanical properties, especially the tensile strength, could be quantitively evaluated by the combination of IUCT test and the developed MATLAB program.
- Subjects :
- 0209 industrial biotechnology
Materials science
Strategy and Management
02 engineering and technology
Management Science and Operations Research
021001 nanoscience & nanotechnology
Signal
Industrial and Manufacturing Engineering
020901 industrial engineering & automation
Frequency domain
Ultimate tensile strength
Ultrasonic sensor
Time domain
Composite material
Diffusion (business)
0210 nano-technology
Joint (geology)
Relative amplitude
Subjects
Details
- ISSN :
- 15266125
- Volume :
- 47
- Database :
- OpenAIRE
- Journal :
- Journal of Manufacturing Processes
- Accession number :
- edsair.doi...........64a8fa7dbef2f4ff7cd4c5fa5dc7fa4d
- Full Text :
- https://doi.org/10.1016/j.jmapro.2019.09.025