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Hardening mechanisms in irradiated Cu–W alloys
- Source :
- Journal of Materials Research. 32:3156-3164
- Publication Year :
- 2017
- Publisher :
- Springer Science and Business Media LLC, 2017.
-
Abstract
- This work investigates the relative contributions to strengthening from twinning, solid-solution, precipitation, and irradiation hardening mechanisms in sputtered Cu–W thin films irradiated to different doses. A nanograin solid solution strengthening mechanism with a linear compositional dependence is observed for the as-grown alloys and for the alloy samples irradiated to 0.5 dpa. Solid solution strengthening is the major strengthening mechanism for Cu99.5W0.5 at all irradiation doses. Irradiation induces precipitation in samples with W concentrations greater than or equal to 1% at doses above ≈0.5 dpa. The growth of 1–4 nm precipitates enhances the hardness of these alloys, and the degree of strengthening is determined by the interparticle spacing. While the alloys exhibit steady-state properties after a relatively low dose (≈1 dpa), the different time scales associated with detwinning and damage accumulation in pure Cu lead transients at higher doses (>5 dpa).
- Subjects :
- 010302 applied physics
Materials science
Precipitation (chemistry)
Mechanical Engineering
fungi
Metallurgy
Alloy
02 engineering and technology
engineering.material
Nanoindentation
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
Solid solution strengthening
Mechanics of Materials
0103 physical sciences
engineering
Hardening (metallurgy)
General Materials Science
Irradiation
Composite material
Thin film
0210 nano-technology
Crystal twinning
Subjects
Details
- ISSN :
- 20445326 and 08842914
- Volume :
- 32
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Research
- Accession number :
- edsair.doi...........64064b9e9d2150f78dca780af42c6c4c