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Inductively coupled plasma etching of bulk tungsten for MEMS applications
- Source :
- 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).
- Publication Year :
- 2014
- Publisher :
- IEEE, 2014.
-
Abstract
- Tungsten based MEMS devices have the potential to be used for many applications, such as tools for micro electrical discharge machining and ultrasonic machining, or mold for inject molding. For the first time, bulk tungsten inductively coupled plasma (ICP) etching was developed and characterized, which is capable of producing high aspect ratio (>13) structures with feature size below 3μm. Etching depth of 230μm has been achieved at an etch rate up to 2.2μm/min. This technology offers big opportunities for MEMS applications.
- Subjects :
- Microelectromechanical systems
Materials science
business.industry
Analytical chemistry
chemistry.chemical_element
Tungsten
Electrical discharge machining
chemistry
Etching (microfabrication)
Ultrasonic machining
Optoelectronics
Dry etching
Reactive-ion etching
Inductively coupled plasma
business
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)
- Accession number :
- edsair.doi...........63128cad0bef525fbe25e89cd7ae5789
- Full Text :
- https://doi.org/10.1109/memsys.2014.6765687