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Advanced Measurement and Simulation Approach for DDR5 On-chip SI/PI with the Probing Package
- Source :
- 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
- Accession number :
- edsair.doi...........61ffcc22d959748a2c56544fffc34621
- Full Text :
- https://doi.org/10.1109/epeps53828.2022.9947122