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Resistive switching characteristic and uniformity of low-power HfO x -based resistive random access memory with the BN insertion layer
- Source :
- Chinese Physics B. 25:107302
- Publication Year :
- 2016
- Publisher :
- IOP Publishing, 2016.
-
Abstract
- In this letter, the Ta/HfO x /BN/TiN resistive switching devices are fabricated and they exhibit low power consumption and high uniformity each. The reset current is reduced for the HfO x /BN bilayer device compared with that for the Ta/HfO x /TiN structure. Furthermore, the reset current decreases with increasing BN thickness. The HfO x layer is a dominating switching layer, while the low-permittivity and high-resistivity BN layer acts as a barrier of electrons injection into TiN electrode. The current conduction mechanism of low resistance state in the HfO x /BN bilayer device is space-charge-limited current (SCLC), while it is Ohmic conduction in the HfO x device.
- Subjects :
- 010302 applied physics
Materials science
business.industry
Bilayer
General Physics and Astronomy
chemistry.chemical_element
Nanotechnology
02 engineering and technology
Electron
021001 nanoscience & nanotechnology
01 natural sciences
Power (physics)
Resistive random-access memory
chemistry
Resistive switching
0103 physical sciences
Electrode
Optoelectronics
0210 nano-technology
Tin
business
Layer (electronics)
Subjects
Details
- ISSN :
- 16741056
- Volume :
- 25
- Database :
- OpenAIRE
- Journal :
- Chinese Physics B
- Accession number :
- edsair.doi...........619a788d93b3ff002afff1e37e8e4089