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Low Dk/Df polyimide adhesives for low transmission loss substrates
- Source :
- 2017 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2017
- Publisher :
- IEEE, 2017.
Details
- Database :
- OpenAIRE
- Journal :
- 2017 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........60f68b0b9f377f42947a7438e209d139