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Bond properties of silane modified optical adhesives for silicon photonics

Authors :
Kimura Kazushi
Arisa Hagiwara
Hirokazu Kageyama
Seiko Mitachi
Norio Murata
Source :
2014 International Conference on Electronics Packaging (ICEP).
Publication Year :
2014
Publisher :
IEEE, 2014.

Abstract

We report the adhesion properties between glass plates and silicon chips by measuring compression shear strength changes of silane modified optical adhesives, Y-41, Y-42, Y-43, and Y-45R after various reliability tests, with the goal to apply these adhesives to the newly emerging Si-photonics area.

Subjects

Subjects :
Materials science
Silicon photonics
Silicon
chemistry.chemical_element
Epoxy
Adhesion
Silane
chemistry.chemical_compound
chemistry
visual_art
Bond properties
visual_art.visual_art_medium
Shear strength
sense organs
Adhesive
Composite material

Details

Database :
OpenAIRE
Journal :
2014 International Conference on Electronics Packaging (ICEP)
Accession number :
edsair.doi...........602cdd0a57e8df8ea5987184b4075bdd
Full Text :
https://doi.org/10.1109/icep.2014.6826772
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