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Tolerance Variation and Passive Alignment in Modular, Polymer Microfluidic Devices

Authors :
Steven A. Soper
Daniel S. Park
Wilfredo M. Caceres
Dimitris E. Nikitopoulos
Michael C. Murphy
Christopher W. Mock
Byoung Hee You
Source :
Microelectromechanical Systems.
Publication Year :
2006
Publisher :
ASMEDC, 2006.

Abstract

Simulations and experiments to assess the predictability of dimensional and locational tolerances of passive alignment structures on injection molded microfluidic components were performed. A center-gated disk with microscale assembly features, to aid metrology, was reproduced using injection molding. The feature dimensions were 100, 200, 300, and 400 μ. Dimensions of the features were measured using optical profilometery and optical microscopy. Simulations using a commercial package overestimated replication fidelity. Mold surface temperatures and injection speeds significantly affected the replication fidelity as the ratio of surface area to volume increased. The location of better replication fidelity, at each mold surface temperature, moved from the edge of the mold cavity to the injection point as the mold surface temperature increased from 100°C to 150°C. Therefore, process parameters and the design of a mold have to be considered for successful replication of the features.Copyright © 2006 by ASME

Details

Database :
OpenAIRE
Journal :
Microelectromechanical Systems
Accession number :
edsair.doi...........5ef5db8b115b051454d2d0a843f14751
Full Text :
https://doi.org/10.1115/imece2006-15258