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3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films

Authors :
D. Lafond
P. Gondcharton
L. Benaissa
G. Rodriguez
B. Imbert
C. Sabbione
D. Mariolle
Source :
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.
Publication Year :
2015
Publisher :
The Japan Society of Applied Physics, 2015.

Subjects

Subjects :
Materials science
chemistry
chemistry.chemical_element
Direct bonding
Tungsten
Composite material
Electrical conductor

Details

Database :
OpenAIRE
Journal :
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials
Accession number :
edsair.doi...........5ec1c3735d3f76e7225faafe6ec29eb7
Full Text :
https://doi.org/10.7567/ssdm.2015.e-2-5
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