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Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication
- Source :
- Journal of Photopolymer Science and Technology. 35:313-319
- Publication Year :
- 2022
- Publisher :
- Technical Association of Photopolymers, Japan, 2022.
- Subjects :
- Polymers and Plastics
Organic Chemistry
Materials Chemistry
Subjects
Details
- ISSN :
- 13496336 and 09149244
- Volume :
- 35
- Database :
- OpenAIRE
- Journal :
- Journal of Photopolymer Science and Technology
- Accession number :
- edsair.doi...........5e6f4c3ddccfc311317a952fdceade00
- Full Text :
- https://doi.org/10.2494/photopolymer.35.313