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Thermal microscopy of electronic materials
- Source :
- Materials Science in Semiconductor Processing. 43:163-176
- Publication Year :
- 2016
- Publisher :
- Elsevier BV, 2016.
-
Abstract
- Due to an increasing level of device integration and progressive device miniaturization, the thermal management requires comprehensive microscopic investigations of thermal properties as heat dissipation on the micro- and nanoscale. Today heat management is one of the key limiting factors in a wide range of electronic applications, e.g. in automotive and electro-mobility. In this review, an overview on far-field and near-field thermal microscopy techniques using infrared thermography, laser beam techniques, and scanning probe microscopy is given. The common aim of all these approaches is to get access to temperature distributions, heat transport mechanisms, thermos-elastic quantities, as well as thermoelectric properties of electronic materials on microscopic levels. Examples for devices inspections, for integrated circuit analysis, and for thin film technology applications at micro and nanoscale are presented.
- Subjects :
- 010302 applied physics
Materials science
Mechanical Engineering
Analytical chemistry
Nanotechnology
02 engineering and technology
Integrated circuit
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
law.invention
Scanning probe microscopy
Thermal conductivity
Mechanics of Materials
law
0103 physical sciences
Microscopy
Thermoelectric effect
Thermography
Miniaturization
General Materials Science
Thin film
0210 nano-technology
Subjects
Details
- ISSN :
- 13698001
- Volume :
- 43
- Database :
- OpenAIRE
- Journal :
- Materials Science in Semiconductor Processing
- Accession number :
- edsair.doi...........5bbce7e1014a48f4bc7d29ad2eef425e