Back to Search Start Over

The use of <scp>3D</scp> in‐mold decoration technology to form a film with printed circuits

Authors :
Ji‐Huan Li
Cheng‐Hsien Wu
Source :
Polymer Engineering & Science. 60:2517-2528
Publication Year :
2020
Publisher :
Wiley, 2020.

Subjects

Subjects :
Printed circuit board
Materials science
Polymers and Plastics
Mold
Materials Chemistry
medicine
Mechanical engineering
General Chemistry
medicine.disease_cause
Thermoforming

Details

ISSN :
15482634 and 00323888
Volume :
60
Database :
OpenAIRE
Journal :
Polymer Engineering & Science
Accession number :
edsair.doi...........5b8f0281e680bb6fd522771bddd7a7ce
Full Text :
https://doi.org/10.1002/pen.25490
Full Text Access
View/download PDF

Tools

Authors Abstract Subjects Details