Electro-Mechanical Properties of Metal–Insulator–Metal Device Fabricated on Polymer Substrate Using Low-Temperature Process

MLA

Jeong In Han, et al. “Electro-Mechanical Properties of Metal–Insulator–Metal Device Fabricated on Polymer Substrate Using Low-Temperature Process.” Japanese Journal of Applied Physics, vol. 41, Feb. 2002, pp. 533–40. EBSCOhost, https://doi.org/10.1143/jjap.41.533.

APA

Jeong In Han, Sung Jei Hong, Min Gi Kwak, Won Keun Kim, Kwan Soo Chung, Sung Kyu Park, & Myung-Jae Lee. (2002). Electro-Mechanical Properties of Metal–Insulator–Metal Device Fabricated on Polymer Substrate Using Low-Temperature Process. Japanese Journal of Applied Physics, 41, 533–540. https://doi.org/10.1143/jjap.41.533

Chicago

Jeong In Han, Sung Jei Hong, Min Gi Kwak, Won Keun Kim, Kwan Soo Chung, Sung Kyu Park, and Myung-Jae Lee. 2002. “Electro-Mechanical Properties of Metal–Insulator–Metal Device Fabricated on Polymer Substrate Using Low-Temperature Process.” Japanese Journal of Applied Physics 41 (February): 533–40. doi:10.1143/jjap.41.533.