Improving process reliability by means of detection of weld seam irregularities in copper via thermographic process monitoring

MLA

Michael Schmidt, et al. “Improving Process Reliability by Means of Detection of Weld Seam Irregularities in Copper via Thermographic Process Monitoring.” Procedia Manufacturing, vol. 36, Jan. 2019, pp. 58–63. EBSCOhost, https://doi.org/10.1016/j.promfg.2019.08.009.

APA

Michael Schmidt, S. Roth, F. Kaufmann, J. Saffer, Kerstin Schaumberger, M. Beck, & Jakob Ermer. (2019). Improving process reliability by means of detection of weld seam irregularities in copper via thermographic process monitoring. Procedia Manufacturing, 36, 58–63. https://doi.org/10.1016/j.promfg.2019.08.009

Chicago

Michael Schmidt, S. Roth, F. Kaufmann, J. Saffer, Kerstin Schaumberger, M. Beck, and Jakob Ermer. 2019. “Improving Process Reliability by Means of Detection of Weld Seam Irregularities in Copper via Thermographic Process Monitoring.” Procedia Manufacturing 36 (January): 58–63. doi:10.1016/j.promfg.2019.08.009.