Improvement of trade-off between mechanical properties and dielectric of polyimide with surface modified silica nanoparticle for wafer level packaging

Subjects

Subjects :

General Chemical Engineering

Details

ISSN :

1226086X

Volume :

114

Database :

OpenAIRE

Journal :

Journal of Industrial and Engineering Chemistry

Accession number :

edsair.doi...........565afdeffa9c7d8c7a58beedb2d8747c

Full Text :

https://doi.org/10.1016/j.jiec.2022.07.034