Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate

MLA

Jeong-Won Yoon, and Seung-Boo Jung. “Investigation of Interfacial Reactions between Sn–5Bi Solder and Cu Substrate.” Journal of Alloys and Compounds, vol. 359, Sept. 2003, pp. 202–08. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........54092e38b7503926791f23c89732441c&authtype=sso&custid=ns315887.

APA

Jeong-Won Yoon, & Seung-Boo Jung. (2003). Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate. Journal of Alloys and Compounds, 359, 202–208.

Chicago

Jeong-Won Yoon, and Seung-Boo Jung. 2003. “Investigation of Interfacial Reactions between Sn–5Bi Solder and Cu Substrate.” Journal of Alloys and Compounds 359 (September): 202–8. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........54092e38b7503926791f23c89732441c&authtype=sso&custid=ns315887.