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Effect of texturing process involving saw-damage etching on crystalline silicon solar cells
- Source :
- Applied Surface Science. 284:133-137
- Publication Year :
- 2013
- Publisher :
- Elsevier BV, 2013.
-
Abstract
- For high efficiency silicon solar cells, surface texturing is used to increase the short circuit current by reducing the surface reflection loss. Surface texturing is an anisotropic wet chemical etching process commonly used to form random pyramids. We investigated how the process is affected by surface conditions. We also compared the texturing behavior and cell performances of as-cut, polished and saw-damage etched wafers. Textured samples with different processing times were analyzed to detect pyramids and determine weighted reflectances. After the texturing process, conventional screen-printed solar cells were fabricated to observe the cell performance. The pseudo I – V curves and quantum efficiency for the samples were analyzed. Performance of samples with different surface conditions makes no difference. Thus, the processing-cost of solar cells can be reduced by omitting the saw-damage etching process.
- Subjects :
- Materials science
Silicon
business.industry
technology, industry, and agriculture
food and beverages
General Physics and Astronomy
chemistry.chemical_element
Surfaces and Interfaces
General Chemistry
Condensed Matter Physics
Isotropic etching
Surfaces, Coatings and Films
Optics
chemistry
Etching (microfabrication)
Optoelectronics
Wafer
Quantum efficiency
Crystalline silicon
Anisotropy
business
Short circuit
Subjects
Details
- ISSN :
- 01694332
- Volume :
- 284
- Database :
- OpenAIRE
- Journal :
- Applied Surface Science
- Accession number :
- edsair.doi...........518fcebf6cb3bcc83157cc429d064f66