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Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling

Authors :
C. Penny
K. Motoyama
S. Ghosh
T. Bae
N. Lanzillo
S. Sieg
C. Park
L. Zou
H. Lee
D. Metzler
J. Lee
S. Cho
M. Shoudy
S. Nguyen
A. Simon
K. Park
L. Clevenger
B. Anderson
C. Child
T. Yamashita
J. Arnold
T. Wu
T. Spooner
K. Choi
K-I. Seo
D. Guo
Source :
2022 International Electron Devices Meeting (IEDM).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 International Electron Devices Meeting (IEDM)
Accession number :
edsair.doi...........4f1057ce776c9492d42cb725b180234a

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