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Kinetic mechanism of surface instability evolution during etching, corrosion, and growth of elastically stressed solids
- Source :
- Physics of the Solid State. 43:169-175
- Publication Year :
- 2001
- Publisher :
- Pleiades Publishing Ltd, 2001.
-
Abstract
- Corrosion precursors in the form of microgrooves appearing on the elastically compressed surface of a silicon plate under etching are investigated. No corrosion precursors are observed on the elastically stretched surface. This distinguishes the observed effect from corrosion cracking of metals, during which corrosion usually takes place on stretched surfaces. The general dynamic model proposed for the evolution of surface microgrooves during etching, corrosion, and growth of elastically stressed solids is based on the concept of two local etching (growth) rates which are linear functions of the local stress tensor. The model describes the kinetics of the process, and the asymmetry of corrosion evolution to the deformation sign. The role of stacking faults, dislocations, and artificially created surface steps in the evolution of corrosion in stressed silicon crystals is studied.
- Subjects :
- Materials science
Silicon
Solid-state physics
Physics::Instrumentation and Detectors
Cauchy stress tensor
Mathematics::Analysis of PDEs
chemistry.chemical_element
Condensed Matter Physics
Instability
Computer Science::Other
Electronic, Optical and Magnetic Materials
Corrosion
Condensed Matter::Materials Science
Cracking
chemistry
Etching (microfabrication)
Physics::Chemical Physics
Deformation (engineering)
Composite material
Subjects
Details
- ISSN :
- 10906460 and 10637834
- Volume :
- 43
- Database :
- OpenAIRE
- Journal :
- Physics of the Solid State
- Accession number :
- edsair.doi...........4ea4284c073667810e71819963d83a2a
- Full Text :
- https://doi.org/10.1134/1.1340204