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Residual Stress Behavior and Characterization of Polyimide Crosslinked Networks via Ring-opening Metathesis Polymerization
- Source :
- Polymer Korea. 38:752-759
- Publication Year :
- 2014
- Publisher :
- The Polymer Society of Korea, 2014.
-
Abstract
- Cross-linked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the cross-linked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of cross-linked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the cross-linked PI makes them potential candidates for versatile high-density multi-layer structure applications.
- Subjects :
- Thermogravimetric analysis
Materials science
Polymers and Plastics
General Chemical Engineering
Stress (mechanics)
Differential scanning calorimetry
Chemical engineering
Polymerization
Residual stress
Polymer chemistry
Materials Chemistry
Ring-opening metathesis polymerisation
Thermomechanical analysis
Polyimide
Subjects
Details
- ISSN :
- 0379153X
- Volume :
- 38
- Database :
- OpenAIRE
- Journal :
- Polymer Korea
- Accession number :
- edsair.doi...........4ca9959ddb8f69e7f110686e8ed2ac71
- Full Text :
- https://doi.org/10.7317/pk.2014.38.6.752