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Residual Stress Behavior and Characterization of Polyimide Crosslinked Networks via Ring-opening Metathesis Polymerization

Authors :
Ki Ho Nam
Haksoo Han
Jongchul Seo
Wonbong Jang
Source :
Polymer Korea. 38:752-759
Publication Year :
2014
Publisher :
The Polymer Society of Korea, 2014.

Abstract

Cross-linked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the cross-linked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of cross-linked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the cross-linked PI makes them potential candidates for versatile high-density multi-layer structure applications.

Details

ISSN :
0379153X
Volume :
38
Database :
OpenAIRE
Journal :
Polymer Korea
Accession number :
edsair.doi...........4ca9959ddb8f69e7f110686e8ed2ac71
Full Text :
https://doi.org/10.7317/pk.2014.38.6.752