Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

Subjects

Subjects :

Materials science
Electronic engineering
Three-dimensional integrated circuit
Nanotechnology
Flip chip

Details

Database :

OpenAIRE

Journal :

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Accession number :

edsair.doi...........4b76879362e545daf6a6758abe9fadf7

Full Text :

https://doi.org/10.1109/ectc.2014.6897471