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optimization fingerprint reconstruction using deep learning algorithm

Authors :
Ming-Sie Pan
Chao-Hsin Fan
Yih-Lon Lin
Hsiang-Chen Hsu
Source :
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Accession number :
edsair.doi...........4a73143726d2e12d18aa8a1f7cdccac9

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