Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films

MLA

Jong-Woong Kim, et al. “Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-Conductive Films.” Journal of Adhesion Science and Technology, vol. 22, Jan. 2008, pp. 1339–54. EBSCOhost, https://doi.org/10.1163/156856108x309486.

APA

Jong-Woong Kim, Wansoo Nah, Jae-Hoon Ko, Hyuk-Chon Kwon, Seung-Boo Jung, Myung Yung Jeong, & Young-Chul Lee. (2008). Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films. Journal of Adhesion Science and Technology, 22, 1339–1354. https://doi.org/10.1163/156856108x309486

Chicago

Jong-Woong Kim, Wansoo Nah, Jae-Hoon Ko, Hyuk-Chon Kwon, Seung-Boo Jung, Myung Yung Jeong, and Young-Chul Lee. 2008. “Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-Conductive Films.” Journal of Adhesion Science and Technology 22 (January): 1339–54. doi:10.1163/156856108x309486.