Back to Search
Start Over
Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging
- Source :
- 2023 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........494bdb9d3a05357b774e896f60117c9f
- Full Text :
- https://doi.org/10.23919/icep58572.2023.10129703