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Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems

Authors :
Toshiaki Shirasaka
Tadashi Okuda
Tomoaki Shibata
Satoshi Yoneda
Daisaku Matsukawa
Murugesan Mariappan
Mitsumasa Koyanagi
Takafumi Fukushima
Source :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Accession number :
edsair.doi...........48a0e3b6b6b1bec9cdd9db8ceefcda3a

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