A New Flip-Chip Bonding Method Using Ultra-Precision Cutting of Metal/Adhesive Layers

Authors :: Taiji Sakai
Masataka Mizukoshi
Seiki Sakuyama
Source :: Journal of Japan Institute of Electronics Packaging. 11:217-222
Publication Year :: 2008
Publisher :: Japan Institute of Electronics Packaging, 2008.
Abstract: We have developed a new method of flip-chip bonding for LSI packaging that uses ultra-precision cutting of Au bumps to create an extremely smooth Au surface (Ra

Subjects :: Engineering drawing
Materials science
Metal
chemistry.chemical_compound
chemistry
Benzocyclobutene
visual_art
Chemical-mechanical planarization
visual_art.visual_art_medium
Adhesive
Electrical and Electronic Engineering
Composite material
Electroplating
Ultra precision
Flip chip

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