Study of electron-scattering mechanism in nanoscale Cu interconnects

MLA

R. O. D. Augur, et al. “Study of Electron-Scattering Mechanism in Nanoscale Cu Interconnects.” Journal of Electronic Materials, vol. 32, Oct. 2003, pp. 982–87. EBSCOhost, https://doi.org/10.1007/s11664-003-0079-1.

APA

R. O. D. Augur, Jae-Yong Park, N. L. Michael, Paul Gillespie, & Choong-Un Kim. (2003). Study of electron-scattering mechanism in nanoscale Cu interconnects. Journal of Electronic Materials, 32, 982–987. https://doi.org/10.1007/s11664-003-0079-1

Chicago

R. O. D. Augur, Jae-Yong Park, N. L. Michael, Paul Gillespie, and Choong-Un Kim. 2003. “Study of Electron-Scattering Mechanism in Nanoscale Cu Interconnects.” Journal of Electronic Materials 32 (October): 982–87. doi:10.1007/s11664-003-0079-1.