Limits of high density, low-force pressure contacts

Authors :: Roger Fabian W. Pease
J. Beale
Source :: Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium.
Publication Year :: 2002
Publisher :: IEEE, 2002.
Abstract: The prosaic pressure contact is a source of unreliability not only in completed systems but more seriously in testing of ICs prior to packaging. Using a custom-built apparatus, pressure contacts are characterized with applied forces down to a few nN and contact areas down to 10/sup -11/ cm/sup 2/. Nominally clean gold-gold and iridium-gold contacts in air exhibit resistivities higher than that predicted from a simple model based on the plastic deformation of the gold. Interfacial films appear to be a source of unreliability. The surface film on gold in air appears to disrupt conduction to a similar degree. >

Subjects :: Materials science
Atomic force microscopy
Contact resistance
Electronic packaging
High density
Nanotechnology
Composite material
Thermal conduction
Nanomechanics
Electrical contacts
Surface film

Database :: OpenAIRE
Journal :: Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium
Accession number :: edsair.doi...........476c379e8bce1b7b30364c87598e924b
Full Text :: https://doi.org/10.1109/iemt.1993.398210