Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

MLA

Kang-Seol Lee, et al. “Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, Sept. 2019, pp. 1835–46. EBSCOhost, https://doi.org/10.1109/tcpmt.2019.2895083.

APA

Kang-Seol Lee, Joungho Kim, Subin Kim, Seongsoo Lee, Daeyong Shim, Junyong Park, Youngwoo Kim, Sangmook Oh, HyunWook Park, & Kyungjun Cho. (2019). Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9, 1835–1846. https://doi.org/10.1109/tcpmt.2019.2895083

Chicago

Kang-Seol Lee, Joungho Kim, Subin Kim, Seongsoo Lee, Daeyong Shim, Junyong Park, Youngwoo Kim, Sangmook Oh, HyunWook Park, and Kyungjun Cho. 2019. “Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs.” IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (September): 1835–46. doi:10.1109/tcpmt.2019.2895083.