A NEW PROCESS FOR FABRICATING CONVEX CORNERS IN SILICON

This paper presents an innovative process scheme to fabricate convex corner in silicon for bulk micro-machined micro-mirror. This method combines deep reactive ion etching (DRIE) with anisotropy wet KOH etching process, with corner compensation structures. Using this method, proper mechanical structure, including about 650μm deep silicon recess with flat, silicon — residue free bottom, V-grooves, and U-grooves are realised simultaneously in single wafer.