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Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies
- Source :
- Journal of Physics: Conference Series. 1399:022036
- Publication Year :
- 2019
- Publisher :
- IOP Publishing, 2019.
-
Abstract
- On the basis of finite-element computer modeling, the temperature distribution of a multi-chip integrated circuit was calculated in System on Package configuration, combining Wire-Bond and Flip-Chip technologies. Technical recommendations are suggested for choosing a compound, taking into account the continuous layer of the compound separating the active elements and the heat sink.
Details
- ISSN :
- 17426596 and 17426588
- Volume :
- 1399
- Database :
- OpenAIRE
- Journal :
- Journal of Physics: Conference Series
- Accession number :
- edsair.doi...........463d3d12183e5b44cf441cd9ac2e02b5