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Impact of metal gate electrode on Weibull distribution of TDDB in HfSiON gate dielectrics

Authors :
Koji Nagatomo
Yuichiro Mitani
Izumi Hirano
Katsuyuki Sekine
Yasushi Nakasaki
Seiji Inumiya
Masakazu Goto
Shigeto Fukatsu
Akiko Masada
Source :
2009 IEEE International Reliability Physics Symposium.
Publication Year :
2009
Publisher :
IEEE, 2009.

Abstract

The slope parameter of Weibull plot of Tbd, β, strongly depends on gate electrode material for metalgate/HfSiON gate stacks in n-FETs. Furthermore β of Tbd under bipolar stress is larger than that under DC stress. From these results, it is found that the balance of injected carriers is strongly related to β in terms of the origin of large β for metal-gate/high-k.

Details

Database :
OpenAIRE
Journal :
2009 IEEE International Reliability Physics Symposium
Accession number :
edsair.doi...........462815df514642becc3a8fe56f61e0a3
Full Text :
https://doi.org/10.1109/irps.2009.5173278