Back to Search
Start Over
Impact of metal gate electrode on Weibull distribution of TDDB in HfSiON gate dielectrics
- Source :
- 2009 IEEE International Reliability Physics Symposium.
- Publication Year :
- 2009
- Publisher :
- IEEE, 2009.
-
Abstract
- The slope parameter of Weibull plot of Tbd, β, strongly depends on gate electrode material for metalgate/HfSiON gate stacks in n-FETs. Furthermore β of Tbd under bipolar stress is larger than that under DC stress. From these results, it is found that the balance of injected carriers is strongly related to β in terms of the origin of large β for metal-gate/high-k.
Details
- Database :
- OpenAIRE
- Journal :
- 2009 IEEE International Reliability Physics Symposium
- Accession number :
- edsair.doi...........462815df514642becc3a8fe56f61e0a3
- Full Text :
- https://doi.org/10.1109/irps.2009.5173278