Test results from the comparison of three liquid cooling methods for high-power processors

Authors :: David Copeland
Guy R. Wagner
Justin Dixon
William Maltz
Gary Chan
Kamal Mostafavi
Joseph R. Schaadt
Source :: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Publication Year :: 2016
Publisher :: IEEE, 2016.
Abstract: This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips.

Subjects :: Materials science
Natural convection
Computer cooling
020209 energy
Free cooling
02 engineering and technology
Mechanics
Forced convection
Power (physics)
Cold plate
0202 electrical engineering, electronic engineering, information engineering
Single phase
ComputingMilieux_MISCELLANEOUS
Simulation
Power density

Database :: OpenAIRE
Journal :: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Accession number :: edsair.doi...........420bb15ff140b267b8a47cf086a92183
Full Text :: https://doi.org/10.1109/itherm.2016.7517605

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