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Mechanical property evaluation of TSV-Cu micropillar by compression method
- Source :
- Electronic Materials Letters. 10:851-855
- Publication Year :
- 2014
- Publisher :
- Springer Science and Business Media LLC, 2014.
-
Abstract
- A micro-compression test method was presented to evaluate the mechanical property of the TSV-Cu micropillar in this paper. Firstly, the test sample containing TSV-Cu micropillar was prepared by MEMS micromachining technology. Then, the mechanical property of TSV-Cu micropillar was measured by a self-made micro-compression system. Finally, the effect of thermal treatment on the mechanical property of TSV-Cu micropillar was studied. The experimental results showed that the average yield strength (σ0.2) of the TSV-Cu micropillar was 167 MPa. But it decreased to 137 MPa after being thermally treated at 400°C for 1 hour, which was probably due to the increased grain size of Cu.
Details
- ISSN :
- 20936788 and 17388090
- Volume :
- 10
- Database :
- OpenAIRE
- Journal :
- Electronic Materials Letters
- Accession number :
- edsair.doi...........4054ff9ba666d36bc24ee8b7ab074a7c