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Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process

Authors :
Hongfei Tao
Yuanhang Liu
Dewen Zhao
Xinchun Lu
Source :
Tribology International. 171:107547
Publication Year :
2022
Publisher :
Elsevier BV, 2022.

Details

ISSN :
0301679X
Volume :
171
Database :
OpenAIRE
Journal :
Tribology International
Accession number :
edsair.doi...........3ec1951842d2a5880ad3545fec160e7b
Full Text :
https://doi.org/10.1016/j.triboint.2022.107547