Calibrate MOSFET Micro-Stress Sensors for Electronic Packaging

MLA

Chun-Pai Tang, et al. “Calibrate MOSFET Micro-Stress Sensors for Electronic Packaging.” 2008 10th Electronics Packaging Technology Conference, Dec. 2008. EBSCOhost, https://doi.org/10.1109/eptc.2008.4763507.

APA

Chun-Pai Tang, Hsien Chung, Ben-Je Lwo, Yung-Ching Chao, & Kun-Fu Tseng. (2008). Calibrate MOSFET Micro-Stress Sensors for Electronic Packaging. 2008 10th Electronics Packaging Technology Conference. https://doi.org/10.1109/eptc.2008.4763507

Chicago

Chun-Pai Tang, Hsien Chung, Ben-Je Lwo, Yung-Ching Chao, and Kun-Fu Tseng. 2008. “Calibrate MOSFET Micro-Stress Sensors for Electronic Packaging.” 2008 10th Electronics Packaging Technology Conference, December. doi:10.1109/eptc.2008.4763507.