Determining the Thermal Conductivity of Nanocrystalline Bismuth Telluride Thin Films Using the Differential 3ω Method While Accounting for Thermal Contact Resistance

We have estimated the thermal conductivity of nanocrystalline bismuth telluride thin films using the differential 3ω method, taking into account the thermal contact resistance (TCR) between the substrate and thin-film layers. The thin films were prepared on alumina substrates by radio-frequency (RF) magnetron sputtering at temperature of 200°C. Film thickness varied between 0.8 μm and 3.1 μm. The structural properties of the films were analyzed using x-ray diffraction analysis. Their electrical conductivity, Seebeck coefficient, and power factor were evaluated. For measurement of thermal properties by the differential 3ω method, SiO2 thin films were deposited onto the samples, to act as insulating layers. Thin aluminum wire was then patterned onto the SiO2 layer. The observed variations in temperature amplitude as a function of film thickness indicated that the TCR contribution was very small and could therefore be neglected when estimating the thermal conductivity of the thin films. The thermal conductivity of the nanocrystalline bismuth telluride thin films with thickness of 0.8 μm and 2.1 μm were determined to be 0.55 W/(m K) and 0.48 W/(m K), respectively.