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Simultaneous Measurement for Thickness and P Content of an Electroless Ni/Au Plating Film on Printed Circuit Board by XRF Spectrometry

Authors :
Takayuki Fukai
Masataka Ohgaki
Masaki Izumiyama
Source :
BUNSEKI KAGAKU. 69:515-520
Publication Year :
2020
Publisher :
Japan Society for Analytical Chemistry, 2020.

Subjects

Subjects :
Printed circuit board
Materials science
Plating
Metallurgy
Mass spectrometry
Analytical Chemistry

Details

ISSN :
05251931
Volume :
69
Database :
OpenAIRE
Journal :
BUNSEKI KAGAKU
Accession number :
edsair.doi...........3d4ec71111a196843f10c53f2b06acbf
Full Text :
https://doi.org/10.2116/bunsekikagaku.69.515
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