Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries

A technology was developed for the fabrication of very thin, chip-sized lithium secondary micro batteries. Based on wafer level processing the batteries can be directly implemented into silicon chips, 3D chip stacks or MEMS devices. The batteries were packaged in 200 µm deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators with 7 and 12 mm2 and round foot print were realized.