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Geometrical optimization of boron arsenide inserts embedded in a heat spreader to improve its cooling performance for three dimensional integrated circuits
- Source :
- Numerical Heat Transfer, Part A: Applications. 80:389-410
- Publication Year :
- 2021
- Publisher :
- Informa UK Limited, 2021.
-
Abstract
- This investigation is aimed at the design and optimization of boron arsenide insert structures embedded in the heat spreader of a 3-D Integrated Circuit (IC). The inserts are distributed in three m...
Details
- ISSN :
- 15210634 and 10407782
- Volume :
- 80
- Database :
- OpenAIRE
- Journal :
- Numerical Heat Transfer, Part A: Applications
- Accession number :
- edsair.doi...........38f5b52936473e32930cdcdae58375b0