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An Effective N, N-Diethylthiourea as Accelerator for Microvia Filling via Copper Electrodeposition

An Effective N, N-Diethylthiourea as Accelerator for Microvia Filling via Copper Electrodeposition

Authors :
Yan Wang
Wei Wu Ma
Source :
Advanced Materials Research. 937:214-217
Publication Year :
2014
Publisher :
Trans Tech Publications, Ltd., 2014.

Abstract

The effect of N, N-diethylthiourea (DET) upon the microvia filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling of the electroplating bath was achieved with an addition of DET. The electrochemical study indicated that the polarisation on the cathode was increased with an addition of DET. The results present DET as an accelerator which is beneficial for microvias filling for high density interconnections printed circuit board.

Details

ISSN :
16628985
Volume :
937
Database :
OpenAIRE
Journal :
Advanced Materials Research
Accession number :
edsair.doi...........30a1d25df217bf0830f873c0f7e41fa8
Full Text :
https://doi.org/10.4028/www.scientific.net/amr.937.214