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High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA Application

Authors :
Kisu Joo
Jung Woo Hwang
Yoon-Hyun Kim
Se Young Jeong
Kyu Jae Lee
Jin-Ho Yoon
Source :
International Symposium on Microelectronics. 2018:000734-000740
Publication Year :
2018
Publisher :
IMAPS - International Microelectronics Assembly and Packaging Society, 2018.

Abstract

We studied and demonstrated high-performance Ag epoxy composites. A variety of shaped Ag particles were teste to optimize the electrical properties and mechanical reliability. The resulting Ag epoxy composites containing flake-shaped Ag particles showed less than 5×10−7Ω·m electrical conductivity and about 20mΩ series-resistance of PKG daisy chain, which directly corresponded to the excellent shield effectiveness. The shield effectiveness of resulting EMI shielding layer made of Ag and matrix is as high as 60dB, 65dB, 70dB at 5um, 10um, 20um-thick film, respectively by ASTM standard. We studied that how various factors, such as curing temperature, Ag contents, and film thickness, effects the electrical properties of shielding material and FCBGA package. It was found that the resistivity of conductive shielding material and the series-resistance were affected by the curing temperature than the curing time. Additionally, we demonstrated the electrical properties of AgCu epoxy composites.

Details

ISSN :
23804505
Volume :
2018
Database :
OpenAIRE
Journal :
International Symposium on Microelectronics
Accession number :
edsair.doi...........2fea7116be924a67aa6a6dbb05a9c486
Full Text :
https://doi.org/10.4071/2380-4505-2018.1.000734