Back to Search
Start Over
High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA Application
- Source :
- International Symposium on Microelectronics. 2018:000734-000740
- Publication Year :
- 2018
- Publisher :
- IMAPS - International Microelectronics Assembly and Packaging Society, 2018.
-
Abstract
- We studied and demonstrated high-performance Ag epoxy composites. A variety of shaped Ag particles were teste to optimize the electrical properties and mechanical reliability. The resulting Ag epoxy composites containing flake-shaped Ag particles showed less than 5×10−7Ω·m electrical conductivity and about 20mΩ series-resistance of PKG daisy chain, which directly corresponded to the excellent shield effectiveness. The shield effectiveness of resulting EMI shielding layer made of Ag and matrix is as high as 60dB, 65dB, 70dB at 5um, 10um, 20um-thick film, respectively by ASTM standard. We studied that how various factors, such as curing temperature, Ag contents, and film thickness, effects the electrical properties of shielding material and FCBGA package. It was found that the resistivity of conductive shielding material and the series-resistance were affected by the curing temperature than the curing time. Additionally, we demonstrated the electrical properties of AgCu epoxy composites.
Details
- ISSN :
- 23804505
- Volume :
- 2018
- Database :
- OpenAIRE
- Journal :
- International Symposium on Microelectronics
- Accession number :
- edsair.doi...........2fea7116be924a67aa6a6dbb05a9c486
- Full Text :
- https://doi.org/10.4071/2380-4505-2018.1.000734