A measurement method for the chip-to-board transmission of radio frequency waves in the power distribution networks with simple embedded circuits

The chip-to-board model is important for predicting the electromagnetic emission (EME) of an electronic system and checking whether it fulfills the emission standards at early design cycle. This paper proposes to build the chip-to-board model through directly measuring the chip-to-board transmission ratio with embedded circuit. The embedded circuit does not cause the modification the on-chip power distribution network. Only one signal pin is added to the chip. It preserves the original physical structure of the chip and package in a maximal way. The measurement method is verified through transistor level simulations and is demonstrated with a test chip. Using the measured transmission ratio, one can build a chip-to-board model with improved accuracy, especially in the high frequency range, for the EME simulation of electronic system.