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IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices
- Source :
- IEEE Power Electronics Magazine. 5:26-33
- Publication Year :
- 2018
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2018.
-
Abstract
- The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power semiconductors in power electronics. This article summarizes the progress toward an initial roadmap for the packaging and integration working group of the ITRW.
- Subjects :
- 010302 applied physics
Engineering
business.industry
Group (mathematics)
Band gap
020208 electrical & electronic engineering
Energy Engineering and Power Technology
02 engineering and technology
01 natural sciences
Control and Systems Engineering
Power electronics
0103 physical sciences
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Position paper
Power semiconductor device
Technology roadmap
Electrical and Electronic Engineering
Telecommunications
business
Working group
Subjects
Details
- ISSN :
- 23299215 and 23299207
- Volume :
- 5
- Database :
- OpenAIRE
- Journal :
- IEEE Power Electronics Magazine
- Accession number :
- edsair.doi...........2f19c7b1ea506a444e407e848be7a52f