Scanning electron microscopy and electron microprobe analysis of Au-GeOx-Cu and Au-AlOx-Cu sandwich structures

Direct observations of the counter-electrode surface of electroformed Au-I-Cu sandwich structures (where I is reactively evaporated AlO x or GeO x ) were carried out using scanning electron microscopy. Electron microprobe analyses of surface defects in electroformed samples, after etching the copper counter-electrode, tended to confirm the presence of copper. Surface defects are identified as the terminations of filament bundles, which supports the filamentary model of conduction.