Back to Search
Start Over
Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials
- Source :
- IEEE Transactions on Power Electronics. 37:6285-6289
- Publication Year :
- 2022
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2022.
- Subjects :
- Electrical and Electronic Engineering
Subjects
Details
- ISSN :
- 19410107 and 08858993
- Volume :
- 37
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Power Electronics
- Accession number :
- edsair.doi...........2daa52ae8a854e205bca3f7f874794e4
- Full Text :
- https://doi.org/10.1109/tpel.2022.3142273