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Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials

Authors :
Guo-Quan Lu
Cyril Buttay
Khai Ngo
Shengchang Lu
Zichen Zhang
Source :
IEEE Transactions on Power Electronics. 37:6285-6289
Publication Year :
2022
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2022.

Details

ISSN :
19410107 and 08858993
Volume :
37
Database :
OpenAIRE
Journal :
IEEE Transactions on Power Electronics
Accession number :
edsair.doi...........2daa52ae8a854e205bca3f7f874794e4
Full Text :
https://doi.org/10.1109/tpel.2022.3142273