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Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Authors :
Takafumi Fukushima
Shinichi Sakuyama
Masatomo Takahashi
Hiroyuki Hashimoto
Jichoel Bea
Theodorus Marcello
Hisashi Kino
Tetsu Tanaka
Mitsumasa Koyanagi
Murugesan Mariappan
Source :
2021 IEEE International 3D Systems Integration Conference (3DIC).
Publication Year :
2021
Publisher :
IEEE, 2021.

Details

Database :
OpenAIRE
Journal :
2021 IEEE International 3D Systems Integration Conference (3DIC)
Accession number :
edsair.doi...........2cbd074f6a3c1d933e4591197456ad51

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