Thermodynamic database on microsolders and copper-based alloy systems

Recent progress on the thermodynamic databases of calculated phase diagrams in microsolders and Cu-based alloys is presented. A thermodynamic tool, Alloy Database for Microsolders (ADAMIS), is based on comprehensive experimental and thermodynamic data accumulated with the calculation of phase diagrams (CALPHAD) method and contains eight elements, namely, Ag, Bi, Cu, In, Sb, Sn, Zn, and Pb. It can handle all combinations of these elements and all composition ranges. The elements of Al and Au have also been added to ADAMIS within a limited range of compositions. Furthermore, a database of Cu-based alloys, including binary (Cu-X), ternary (Cu-Fe-X, Cu-Ni-X, and Cu-Cr-X), and multicomponent (Cu-Ni-Cr-Sn-Zn-Fe-Si) systems, has also been developed. Typical examples of the calculation and application of these data-bases are presented. These databases are expected to be a powerful tool for the development of Pb-free solders and Cu substrate materials as well as for promoting the understanding of the interfacial phenomena between them in electronic packaging technology.